By Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Three-dimensional (3D) integration is pointed out as a potential road for non-stop functionality progress in built-in circuits (IC) because the traditional scaling procedure is confronted with remarkable demanding situations in basic and monetary limits. Wafer point 3D IC can take numerous types, and so they often contain a stack of a number of thinned IC layers which are vertically bonded and interconnected via via silicon through TSV.
There is a protracted string of advantages that you can still derive from 3D IC implementation akin to shape issue, density multiplication, more suitable hold up and tool, more advantageous bandwidth, and heterogeneous integration. This publication offers contributions by way of key researchers during this box, overlaying motivations, know-how structures, purposes, and different layout concerns.
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3D Integration for VLSI Systems by Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester